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SOLVENT CLEANING SYSTEMS
Microsolve ultrasonic precision cleaning systems attain the highest cleaning standards yet keep running costs surprisingly low.
Users have a choice of processes: in broad terms MONO-SOLVENT for general precision cleaning, CO-SOLVENT where contamination is particularly heavy or for some applications in electronics, and
3-SUMP for certain special applications.
Options
Options include dual frequency ultrasonics, solvent monitoring with auto top-up, and a choice of Autotrans robotic work handling systems. |
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LOW SOLVENT USAGE
Solvent retention features unique to Microsolve systems - triple coil reflux cooling, vapour break, 150% freeboard, optional solvent monitoring and auto top-up - ensure that our systems are safe to use and fully compliant with environmental and safety legislation including the Solvent Emissions Directive (SED). These design features also mean that Microsolve systems operate with low, predictable solvent usage and customers enjoy
low, predictable running costs.
Our solvent monitoring device allows users to check consumption: 3 litres of HFE per 40-hour week is typical in a Co-solvent 350 system. |
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Microsolve 250 Mono-solvent system with Autotrans Single Axis work handling system
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Microsolve Mono-Solvent two-stage systems provide ultrasonic cleaning using HFE (hydrofluoroether) or HFC (hydrofluoro-carbon) solvents, followed by vapour rinsing and freeboard dry.
Typical applications include bearings, gyro components and precision medical components; maintenance cleaning of pneumatic and hydraulic components; and, in electronics, flux removal from PCBs or from soldering jigs and fixtures.
 | Mono-solvent 250 leaflet*
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| Mono-solvent 350 leaflet*
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| Mono-solvent 450 leaflet*
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| Mono-solvent 525 leaflet*
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Microsolve 350 mono-solvent system cleans seals prior to bonding
Microsolve 250 mono-solvent system reduces solvent consumption by 85% for medical device manufacturer
Microsolve Co-Solvent systems provide two ultrasonic cleaning stages, followed by vapour rinsing and freeboard dry. In the first cleaning stage a mixture of HFE and a hydrocarbon solvating agent removes gross contamination from
the components. Large quantities
of dirt and oils can be taken up by
the solvating agent, making the process particularly suitable for heavy duty ultrasonic cleaning applications.
The Co-solvent process handles with ease applications such as removal of polishing compounds, maintenance cleaning of power generation system components, and flux removal from PCBs, including no-clean and lead-free solder flux residues.
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| Co-solvent 350 leaflet*
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| Co-solvent 450 leaflet*
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| Co-solvent 525 leaflet*
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Microsolve 450 Co-solvent system
with Autotrans Mk4 work handling system
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Microsolve Co-solvent system cleans engine components at Honda Racing
Microsolve Co-solvent 450 cleans hydraulic, pneumatic and power generation system components
Microsolve Co-solvent 350 with dual frequency ultrasonics cleans PCBs to defence standards
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Microsolve 450 3-sump mono-solvent system
cleaning cinematic camera lenses
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Microsolve 3-sump systems are available for certain special applications. In the system shown left, stage 1 provides ultrasonic cleaning and stage 2 an immersion rinse. This is followed by vapour rinsing (provided by sump 3) and freeboard dry.
3-sump Microsolve system cleans dust and grease from cinematic camera lenses
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* To view the PDF leaflets you will need Adobe Acrobat Reader. If you do not have this software please use the link provided left to download a FREE copy.
To view a leaflet click the PDF button. To save the leaflet to your computer right click the button, select 'Save Target As..' and choose a location to save the file to.
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